18 SOLDER FLUX
Call: 1-800-537-0351 · Fax: 1-800-379-9903 Also available in 5 & 53 gallon containers. Call or go online for pricing.
Formulation Flux Type Percent Solids VOCs (g/liter) 951 Rosin Free Low Solids 2.0 792 0.813 + 0.003 959T Low Solids No-Clean 2.9 0 0.794 + 0.005 977 VOC-Free No-Clean 3.25 0 1.012 + 0.010 Developed to reduce bottom side micro-solder balling and bridging. The wettign system is designed to allow for a larger process window and can survive the longer dwell times in extremely turbulent chip waves. Designed for spray applications. Bellcore Issue 1 GR-78-CORE & ANSI/JSTD-004 Flux designator ORL0 985M Low Solids, No-Clean 3.6 776 0.805 + 0.005
Fluxes & Thinners
Very low solids, rosin free, foam and spray application flux. Virtually no residue after the soldering process.
Minimizes micro-solder balls, extremely shiny joints, no streaky white residues
Improves effectiveness of wave soldering in circuit board assemblies. Provides excellent hole fill on thick board assemblies.
Bellcore Issue 1 GR-78-CORE & ANSI/JSTD-004 Flux designator ROL0 Wash with Kester's #5768 Bio-Kleen saponifier at 2% concentration 110 1 Gallon
Bellcore Issue 1 GR-78-CORE & ANSI/JSTD-004 Flux designator ORL0
Bellcore GR-78-CORE & IPC/J-STD-004B Flux designator ROLO
No-Clean Fluxes & Thinners
No-Clean fluxes and VOC free no-clean fluxes are designed for wave-soldering and surface mount circuit board assemblies. These extremely low-solid-content fluxes leave virtually no residue after soldering with no offensive odors. They are formulated to provide good activity and are halogen-free, non-corrosive, and have no surface insulation resistance degradation. No clean fluxes are an environmentally safe alternative to solvent cleaning. Eliminating the need for a cleaning process offers a significant cost-savings. Hazardous ground surcharges apply.
Residue Removal (not normally required) Thinner Size Part # Price:
Wash with hot de-ionized water at 140-160oF or use Wash with Kester's #5768 1% solution of Kester's Bio-Kleen saponifier at 2% #5768 Bio-Kleen saponifier concentration in water 4662 1 Gallon De-ionized Water 1 Gallon 4662 1 Gallon
Formulation Flux Type Percent Solids Percent Halides Specific Gravity Product Characteristics Compliant Specifications Residue Removal Thinner 0.843 + 0.005 Clear homogeneous solution, consistently high quality. ANSI/J-STD-004, J-STD-003, J-STD-002, Flux designator ROL1 Residue is non-corrosive, but may be removed with solvent or Kester's #5768 Bio-Kleen saponifier at 7-10% solution in de-ionized or soft water at 120 - 140oF 182 Activated Rosin (RA) 25 186-18 Rosin Mildly Activated (RMA) 18 0.02 0.879 + 0.005 Designed for high thermal stability and superior solderability. ANSI/J-STD-004 Flux designator ROL1 Residue is non-corrosive, but may be removed with solvent or Kester's #5768 Bio-Kleen saponifier at 7-10% solution in de-ionized or soft water at 120 - 140oF 120 1 Gallon 1 Gallon 186 Rosin Mildly Activated 36 0.02 0.879 + 0.003 High thermal stability for multi-layer assemblies requiring high pre-heat temperature. Residue is non-corrosive and non-conductive. IPC/J-STD 004, Flux Designator ROLO
Rosin Fluxes & Thinners
Rosin Fluxes are formulated with high-quality purified rosin, conforming to LLL-R-626 in specially blended solvent systems. The choice of the proper flux formula is based on the soldering application, desired rosin percentage and the activity level required. All residues are non-corrosive but may be removed with solvent.
Use solvent at 7-10% solution in de-ionized water at 120-150oF 120 1 Gallon
Water Soluble & Thinners
Water-Soluble Fluxes provide better fluxing abilites and wider processing windows than traditional rosin fluxes. Water cleaning is a popular alternative to CFC-solvent cleaning (now eliminated). Water-soluble flux residues are designed to be removed with either in-line or batch hot-water cleaning processes. Please note: a circuit board's design must be compatible with the use of organic fluxes and water cleaning since all of the residue must be removed and the components must be able to tolerate water. These products are regulated by the Department of Transportation (DOT) and may be subject to surcharges if shipped by ground or by air. Some of these products are subject to other restrictions, and may not be shippable by air. These products are NONRETURNABLE and NON-REFUNDABLE.
Size Part # Price:
Formulation Flux Type Percent Solids VOCs (g/liter) Specific Gravity Percent Halides Product Characteristics Compliant Specifications Residue Removal 2331-ZX Neutral pH Organic Water Soluble 33 729 0.899 + 0.005 2.2 Original pH neutral organic flux for automated wave and drag soldering processes ANSI/J-STD-004 Flux designator ORH1 Residue removal is required. Use soft or de-ionized water at temperatures of 120-150oF. 4662 1 Gallon 2235 Organic Water Soluble 11 763 0.856 + 0.005 1.5 Very active flux for surface mount assemblies designed to help reduce skips on bottom side surface mount pads. ANSI/J-STD-004 Flux designator ORH1 Residue removal is required. Use soft or de-ionized water at temperatures of 120-150oF. 4662 1 Gallon 2224-25 Organic Water Soluble 24 650 0.882 + 0.005 1.5 Highly active, organic flux designed for automated wave soldering applications. Higher percent solids than 2235 for greater heat stability. ANSI/J-STD-004 Flux designator ORH1 Residue removal is required. Use soft or de-ionized water at temperatures of 120-150oF. 4662 1 Gallon
Due to fluctuations in material cost, pricing for Kester items are subject to change daily.
Thinner Size Part # Price: