16 SOLDER BAR & PASTE
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Ultrapure Lead-Free Solder Bar
No Clean R276 Solder Paste
Ultrapure Sn63Pb37 Bar Solder
Manufactured by a special process which controls the inclusions of oxides and metallic and non-metallic impurities, Kester Ultrapure is the industry standard bar solder for use in high tech electronic applications where lower surface tension and hole filling ability are essential. The purity of Kester Ultrapure far exceeds the requirements of QQ-S-571-F, AS B32, and ANSI/J-STD-006. Priced per bar.
Pure lead-free solder alloy for use in wave soldering, selective soldering, and tip tinning applications features the lowest copper dissolution amongst all common solder alloys and other lead-free agents. Eliminates solder joint shrinkage effects with excellent through-hole penetration and topside fillet with a low dross rate. Unique triangular bar shape provides easy identification.
Sn63Pb37 - 12/3 lbs.
Sn60Pb40 - 12/3 lbs.
Ultrapure Sn60Pb40 Bar Solder
Used in applications where large volumes of solder are needed for tinning, sheet metal work and plumbing, Ultrapure bar solder exceeds QQ-S-571-F, AS B32, and ANSI/J-STD-006 requirements. Manufactured through a unique process which controls inclusion of oxides and metallic/non-metallic impurities. Ideal for electrical, electronic and mechanical applications which require lower surface tension and hole filling ability.
Easy Profile 256 No-Clean Solder Paste
No-clean Sn96.5Ag3.0Cu0.5 solder paste is packaged void-free to ensure consistent dispensing in high speed automated processes. Flow characteristics provide for excellent dispensing characteristics with a wide range of needle diameters. 35 gram syringe without a plunger. Powder mesh size: -325/+500 (Type 3). Metals content: 86%. Due to refrigeration requirements, this product must be shipped overnight.
Item # Description 1+
Sn60Pb40 - 12/3 lbs.
KPLFS2760 Lead Free Solder Paste, 35 grams, no plunger KPS27605 Solder Paste, 35 grams, no plunger
$ 23.10 20.30
Ultrapure Low-Dross Bar Solder
Manufactured using the Ultrapure process and containing the same metal purity as Kester Ultrapure , Kester Ultrapure Low Dross is formulated with a special low dross additive which dramatically decreases dross formation on the solder pot. Lower dross formation decreases joint weakening inclusions in the solder, keeps surface tension low, and decreases costly solder loss through drossing. Bars are 12/3 lbs. Priced per bar.
Lead-Free, EnviroMark 907 Solder Paste
Sn63Pb37 - 12/3 lbs.
Lead Free K100LD Ultra Pure Solder Bar
Provides numerous benefits including bright smooth solder joints with no visible shrinkage effects, excellent through-hole penetration and topside fillet with virtually no bridging, reduced leaching of solder pot materials, and a low dross rate for added cost savings. Developed as a low cost and low copper dissolution alternative to common lead-free alloys, it also has a slower rate of copper dissolution than competitive SnCuNi alloys, which minimizes pot maintenance, maintains consistent soldering performance, and improves reliability. Comparable in terms of wetting and flow to other leadfree, low-cost alloys comprised of tin and copper. Alloy: Sn99.3Cu0.7 (99.3% Tin / 0.7% Copper). Melting range: 440°F/227°C. Weight: 1-2/3 lbs. RoHS compliant.
Easy Profile 256 No-Clean Solder Paste is designed for maximum robustness in reflow profiling and printing. Contains the widest possible reflow processing window. Capable of printing downtimes of up to 90 minutes with an effective first print down to 20mils. Maintains its activity and printing characteristics for up to 8 hours without any shear thinning. Compatible with enclosed print head systems. Powder Mesh size is -325/+500 (Type 3) and metal percentage is 90%. Tin to lead alloy is 63/37. Expected tack life is 12+ hours. Compliant to Bellcore Issue 1 GR-78-CORE, ANSI/J-STD-004, classification ROL0. Sold in either 500 gram jars or 600 gram cartridges. Must ship by overnight air due to refrigeration requirements.
Easy Profile 256 500g Jar Easy Profile 256 600g Cartridge
KBLF510 K100LD Lead Free Ultra Pure Solder Bar - 12/3 lbs.
Due to fluctuations in material cost, pricing for Kester items are subject to change daily.
Kester 907 EnviroMark lead free solder paste is a air and nitrogen reflowable no-clean solder paste specifically designed for the thermal requirements of lead free alloys, including the Sn96.5Ag3.0Cu0.5 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. EM907 is with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6"/s (150 mm/s). This solder paste also exceeds the reliability standards required by J-STD-004. Sold in either 500 gram jars or 600 gram cartridges. Must ship by overnight air due to refrigeration requirements.
KPLFJ9070 EnviroMark 907 500g Jar KPLFC9070 EnviroMark 907 600g Cartridge
$ 97.30 121.66